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Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

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Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications
Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Duży Obraz :  Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZG
Orzecznictwo: CE
Numer modelu: SM
Zapłata:
Minimalne zamówienie: 1 szt
Cena: 10USD/PC
Szczegóły pakowania: mocne drewniane pudełko
Czas dostawy: 5-8 dni roboczych
Zasady płatności: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Możliwość Supply: 1000szt

Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Opis
Podkreślić:

High Brittleness Transparent Ceramic

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Low Thermal Expansion Brittle Ceramic

,

Semiconductor Grade Technical Ceramic

Transparent Brittle Ceramic
Quartz glass, microcrystalline glass, sapphire, and other transparent materials are characterized by high brittleness and hardness. ZG has conducted extensive research on processing these advanced materials and currently supplies products for semiconductor, optical, and military industries. We offer various materials including high borosilicate glass, ultra-low expansion microcrystalline glass, and sapphire for applications in semiconductor windows, precision measuring instruments, space telescopes, microchannel reactors, and other specialized uses.
ZERODUR Low Thermal Expansion Glass-Ceramic
Physical Characteristics ZERODUR ZERODUR K20
Density (g/cm³) 2.53 2.53
Poisson's Ratio 0.24 0.25
Knoop Hardness HK 0.1/20 (ISO 9385) 620 620
Refractive Index nd 1.5424 -
Abbey Numbers vd 56.1 -
Thermal Conductivity (W/m·K) 1.46 1.63
Thermal Diffusion Coefficient at 20°C (10⁻⁶m²/s) 0.72 -
Specific Heat at 20°C (J/g·K) 0.80 0.90
Young's Modulus E (GPa) average at 20°C 90.3 84.7
Internal Transmittance Ti with 580nm/5mm thickness 0.95 -
Internal Transmittance Ti with 580nm/10mm thickness 0.9 -
Stress Optical Coefficient K (λ=589.3nm, 10⁻⁶MPa⁻¹) 3 -
Electric Resistivity ρ (Ω·cm) at 20°C 2.6×10¹³ -
Tk100°C, ρ=10⁸ (Ω·cm) humidity 178 -
Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications 0 Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications 1

Szczegóły kontaktu
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Osoba kontaktowa: Daniel

Tel: 18003718225

Faks: 86-0371-6572-0196

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